IndiumV3, Main, Repository, bibRecord, 003671

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

Identifieur interne : 003671 ( Main/Repository ); précédent : 003670; suivant : 003672

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

Auteurs : RBID : Pascal:10-0227069

Descripteurs français

Pascal (Inist)
- Analyse thermique, Assemblage brasage tendre, Brasage tendre, Indium, Fusion, Trempe, Microscopie électronique balayage, Spectrométrie dispersive, Diffraction électron rétrodiffusé, Solidification, Flux chaleur, Flux thermique, Calorimétrie différentielle balayage, Equilibre phase, Métal fondu brasage tendre, Alliage base étain, Modèle thermodynamique, Composition phase, Diagramme phase, Simulation numérique, SnAgCu, In, 8130F, 8130B.

English descriptors

KwdEn :
- Differential scanning calorimetry, Dispersive spectrometry, EBSD, Heat flow, Heat flux, Indium, Melting, Numerical simulation, Phase composition, Phase diagram, Phase equilibrium, Quenching, Scanning electron microscopy, Solder metal, Soldered joint, Soldering, Solidification, Thermal analysis, Thermodynamic model, Tin base alloys.

Abstract

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/ energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

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Links to Exploration step

Pascal:10-0227069

Le document en format XML

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<front><div type="abstract" xml:lang="en">The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/ energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.</div>
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Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

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